Effect of Liquid/Solid Volume Ratio on Interface Formation and Mechanical Properties of Aluminum – Copper Bimetal by Squeeze Casting
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Abstract
Many industrial applications require lightweight, low cost and high- performance materials. This work created a bimetal (Al-Cu) using the compound casting technique (Squeeze casting). Nickel-electro coating of copper substrates was used before casting; the copper inserted was a cylindrical rod into a carbon steel die, then melted aluminum at (700˚C). The liquid to-solid ratio influenced the formation of the interface (transition region between the two metals). Also the mechanical characteristics of the bimetal (Al-Cu) were studied. The intermetallic compounds were discovered as (Al_2 Cu,AlCu_4,AlCu,Al_4 Cu_(9,) and Cu_4 Al_3). The nickel coating significantly enhanced and strengthened the bimetal (Al-Cu) interconnection by percentages (17% and 3.5%). Many tests and examinations were conducted, such as examining the microstructure with an optical microscope, scanning electron microscope and X-ray diffraction, hardness and interconnection strength examinations due to restricting the formation of intermetallic compounds. The results also showed that the interface had a thickness and good properties at a ratio of liquid to solids of 17% because the large thermal content increased the interface thickness between the two metals. The effect of this ratio was evident through the tests’ results, as the interconnection strength reached 15.5 MPa. The copper and aluminum interfaces' hardness were is 168, 92, and 38 HV, respectively. While the intermetallic compounds were more diverse at a liquid to- solid ratio of 17%.
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Zhang H, Chen Y, Luo AA. A Novel Aluminum Surface Treatment for Improved Bonding in Magnesium/Aluminum Bimetallic Castings. Scripta Materialia 2014; 86:52-55. DOI: https://doi.org/10.1016/j.scriptamat.2014.05.007
Rhee K, Han W, Park H, Kim S. Fabrication of Aluminum/Copper Clad Composite Using Hot Hydrostatic Extrusion Process and Its Material Characteristics. Materials Science and Engineering: A 2004; 384(1-2):70-76. DOI: https://doi.org/10.1016/j.msea.2004.05.051
Su YJ, Liu XH, Huang HY, Wu CJ, Liu XF, Xie JX. Effects of Processing Parameters on the Fabrication of Copper Cladding Aluminum Rods by Horizontal Core-Filling Continuous Casting. Metallurgical and Materials Transactions B 2011; 42:104-113. DOI: https://doi.org/10.1007/s11663-010-9449-2
Lee WB, Bang KS, Jung SB. Effects of Intermetallic Compound on the Electrical and Mechanical Properties of Friction Welded Cu/Al Bimetallic Joints During Annealing. Journal of Alloys and Compounds 2005; 390(1-2):212-219. DOI: https://doi.org/10.1016/j.jallcom.2004.07.057
Kim JM, Shin K, Shin JS. Microstructural Evolution and Growth of Intermetallic Compounds at the Interface between Solid Cast Iron and Liquid Al–Si Alloy. Metals 2020; 10: 759, (1-9). DOI: https://doi.org/10.3390/met10060759
Acarer M. Electrical. Corrosion and Mechanical Properties of Aluminum-Copper Joints Produced by Explosive Welding. Journal of Materials Engineering and Performance 2012;21(11):2375-2379. DOI: https://doi.org/10.1007/s11665-012-0203-6
Zhao H, Wang D, Qin J, Zhang Yh. Research Progress on Bonding Mechanism and Interface Reaction of Cu/Al Laminated Composite. Hot Working Technology 2011;40(10):84-87.
Sheng L, Yang F, Xi T, Lai C, Ye H. Influence of Heat Treatment on Interface of Cu/Al Bimetal Composite Fabricated by Cold Rolling. Composites Part B: Engineering 2011;42(6):1468-1473. DOI: https://doi.org/10.1016/j.compositesb.2011.04.045
Shabani A, Toroghinejad MR, Shafyei A. Effect of Post-Rolling Annealing Treatment and Thickness of Nickel Coating on the Bond Strength of Al–Cu Strips in Cold Roll Bonding Process. Materials & Design 2012; 40:212-220. DOI: https://doi.org/10.1016/j.matdes.2012.03.052
Abbasi M, Taheri AK, Salehi M. Growth Rate of Intermetallic Compounds in Al/Cu Bimetal Produced by Cold Roll Welding Process. Journal of Alloys and Compounds 2001;319(1-2):233-241. DOI: https://doi.org/10.1016/S0925-8388(01)00872-6
Chen S, Ke F, Zhou M, Bai Y. Atomistic Investigation of the Effects of Temperature and Surface Roughness on Diffusion Bonding between Cu and Al. Acta Materialia 2007;55(9):3169-3175. DOI: https://doi.org/10.1016/j.actamat.2006.12.040
Wu C, Yu Z, Xie J, Wu Y. Fabrication of Bimetal Composites of Copper Cladding Aluminum with Process of Continuous Core-Filling Casting. Foundry 2004;53(5):432-434.
Na L, Shouren G, Dezhong L, Zhuangqi H, Jinglin W. Technique of Aluminum Alloy Composite by Inversion Casting. Journal of Materials Sciences and Technology 2002;18(02):187-188.
Papis K, Hallstedt B, Löffler JF, Uggowitzer PJ. Interface Formation in Aluminium–Aluminium Compound Casting. Acta Materialia 2008; 56(13):3036-3043. DOI: https://doi.org/10.1016/j.actamat.2008.02.042
Chen J, Lai YS, Wang YW, Kao CR. Investigation of Growth Behavior of Al–Cu Intermetallic Compounds in Cu Wire Bonding. Microelectronics Reliability 2011;51(1):125-129. DOI: https://doi.org/10.1016/j.microrel.2010.09.034
Mahdi FM, Abtan NS, Ahmed SR. The Study of Effect of Applied Pressure on Microstructure and Actual Density for A380 Alloy by Use Squeeze Casting Process. Tikrit Journal of Engineering Sciences 2013; 20(4):11-17. DOI: https://doi.org/10.25130/tjes.20.4.08
Yue TM, Chadwick G. Squeeze Casting of Light Alloys and Their Composites. Journal of Materials Processing Technology 1996; 58(2-3):302-307. DOI: https://doi.org/10.1016/0924-0136(95)02148-5
Zhang J, et al. Effect of Al Thin Film and Ni Foil Interlayer on Diffusion Bonded Mg–Al Dissimilar Joints. Journal of Alloys and Compounds 2013; 556: 139-142. DOI: https://doi.org/10.1016/j.jallcom.2012.12.106
Kawakami, H. Effect of Bonding Conditions on Al/Cu Dissimilar Bonding with Liquefaction After Solid State Diffusion in the Air. Quarterly Journal of the Japan Welding Society 2007; 25(1): 51-58. DOI: https://doi.org/10.2207/qjjws.25.51
Yuan H, Chen YQ, Li L, Hu HD, Zhu ZA. Microstructure and Properties of Al/Cu Bimetal in Liquid–Solid Compound Casting Process. Transactions of Nonferrous Metals Society of China 2016; 26(6):1555-1563. DOI: https://doi.org/10.1016/S1003-6326(16)64261-9
Zhao JL, Jie JC, Fei CHEN, Hang CHEN, Li TJ, Cao ZQ. Effect of Immersion Ni Plating on Interface Microstructure and Mechanical Properties of Al/Cu Bimetal. Transactions of Nonferrous Metals Society of China 2014;24(6):1659-1665. DOI: https://doi.org/10.1016/S1003-6326(14)63238-6
Bakke AO, Løland JO, Jørgensen S, Kvinge J, Arnberg L, Li Y. Interfacial Microstructure Formation in Al7simg/Cu Compound Castings. International Journal of Metalcasting 2021; 15:40-48. DOI: https://doi.org/10.1007/s40962-020-00463-w
Guan F, Jiang W, Li G, Jiang H, Zhu J, Fan Z. Interfacial Bonding Mechanism and Pouring Temperature Effect on Al/Cu Bimetal Prepared by a Novel Compound Casting Process. Materials Research Express 2019; 6(9): 096529. DOI: https://doi.org/10.1088/2053-1591/ab2d8f
Akbarifar M, Divandari M. On the Interfacial Characteristics of Compound Cast Al/Brass Bimetals. International Journal of Metalcasting 2017;11:506-512. DOI: https://doi.org/10.1007/s40962-016-0101-z
Su YJ, Liu XH, Huang HY, Liu XF, Xie JX. Interfacial Microstructure and Bonding Strength of Copper Cladding Aluminum Rods Fabricated by Horizontal Core-Filling Continuous Casting. Metallurgical and Materials Transactions A 2011;42(13):4088-4099. DOI: https://doi.org/10.1007/s11661-011-0785-x
Zare G, Divandari M, Arabi H. Investigation on Interface of Al/Cu Couples in Compound Casting. Materials Science and Technology 2013; 29(2):190-196. DOI: https://doi.org/10.1179/1743284712Y.0000000096
Fu Y, Zhang YB, Jie JC, Svynarenko K, Liang CH, Li TJ. Interfacial Phase Formation of Al-Cu Bimetal by Solid-Liquid Casting Method. China Foundry 2017; 14(3):194-198. DOI: https://doi.org/10.1007/s41230-017-6057-7
Tanaka Y, Kajihara M, Watanabe Y. Growth Behavior of Compound Layers During Reactive Diffusion between Solid Cu and Liquid Al. Materials Science and Engineering: A 2007;445:355-363. DOI: https://doi.org/10.1016/j.msea.2006.09.047